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Applied Sciences, Free Full-Text
PDF) Under bump metallurgy (UBM) - A technology review for flip chip packaging
A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps
PDF) Pb-free Sn/3.5Ag electroplating bumping process and under bump metallization (UBM)
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect
Micromachines, Free Full-Text
US9082762B2 - Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip - Google Patents
PDF) Planar Packaging and Electrical Characterization of High Temperature SiC Power Electronic Devices
The surface characteristics of under bump metallurgy (UBM) in electroless nickel immersion gold (ENIG) deposition - ScienceDirect
PDF) Microstructure Study of High Lead Bump FCBGA Bending Test
