Numerical and experimental study on protective film removal towards the automation of flexible electronics assembly

PCB fabrication: lamination and curing cycle. Pre-assembled stack-up

New method for fabricating flexible electronics

Sensors, Free Full-Text

3D Printing of Inertial Microfluidic Devices

PCB Substrates: Knowing PCB Dielectric Materials

Application Notes

PDF] A FPCB Cutting Process using a Pico-second Laser

Comparison of Epidian 57/Z1 adhesive failure stresses determined

Graphene-based flexible wearable sensors: mechanisms, challenges, and future directions

The specimen used in the test for estimating the dependence of adhesive

High-throughput fabrication of soft magneto-origami machines

Electrode tool (a) before and (b) after the machining and (c) 3D