Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection

CO2 electrolysis: Advances and challenges in electrocatalyst engineering and reactor design - ScienceDirect

Copper seed layer repair using an electroplating process for through silicon via metallization - ScienceDirect

Structural Accelerating Effect of Chloride on Copper Electrodeposition

PDF) Next generation fine pitch Cu Pillar technology — Enabling next generation silicon nodes

Enhanced electromigration resistance through grain size modulation in copper interconnects

Metal-graphene interfaces in epitaxial and bulk systems: A review - ScienceDirect

Applied Sciences, Free Full-Text

A review of helical nanostructures: Growth theories, synthesis strategies and properties

A review of helical nanostructures: Growth theories, synthesis strategies and properties

Robust Co alloy design for Co interconnects using a self-forming barrier layer

N A N O S P A IN 2 0 1 1

蕴雯 WU, Waseda University, Tokyo, Sōdai, Department of Applied Chemistry

3D Reconstruction and Characterization of Polycrystalline Microstructures Using a FIB–SEM System

Impact of Nanosize on Supercapacitance: Study of 1D Nanorods and 2D Thin-Films of Nickel Oxide