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The BTeV hybrid pixel detector is constructed of readout chips and sensor arrays which are developed separately. The detector is assembled by flip-chip mating of the two parts. This method requires the availability of highly reliable, reasonably low cost fine-pitch flip-chip attachment technology. We have tested the quality of two bump-bonding technologies; indium bumps (by Advanced Interconnect Technology Ltd. (AIT) of Hong Kong) and fluxless solder bumps (by MCNC in North Carolina, USA). The results have been presented elsewhere [1]. In this paper we describe tests we performed to further evaluate these technologies. We subjected 15 indium bump-bonded and 15 fluxless solder bump-bonded dummy detectors through a thermal cycle and then a dose of radiation to observe the effects of cooling, heating and radiation on bump-bonds. We also exercised the processes of HDI mounting and wire bonding to some of the dummy detectors to see the effect of these processes on bump bonds.
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PDF) Study of temperature dependence of bump bonding for the BTeV pixel detector
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Delafosse CHRISTIAN, Medical Doctor, Hospital Simone Veil, Montmorency, department of pneumology
Delafosse CHRISTIAN, Medical Doctor, Hospital Simone Veil, Montmorency, department of pneumology
Coatings, Free Full-Text
PDF) Study of temperature dependence of bump bonding for the BTeV pixel detector
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PDF] Characterization of indium and solder bump bonding for pixel detectors
